Heat dissipation beer and cavity printed circuit board technology.
We have various processing technologies, including heat dissipation vias, cavities, and side terminals!
We would like to introduce the technology of printed circuit boards from Shinko Seisakusho Co., Ltd. We accommodate narrow slits, free shapes, coil patterns, undercoats, and step-through holes. We can manufacture small diameter vias of φ40μm/40μmt and multilayers of 20 layers/2.4mmt. Please feel free to consult us for more details. 【Product Lineup (Partial)】 ■ Narrow Slits ■ Free Shapes ■ Multi-Hole Vias ■ Heat Dissipation Vias ■ Cavities *For more details, please refer to the PDF materials or feel free to contact us.
- Company：伸光製作所
- Price：Other
